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MICRON TECHNOLOGY INC

Micron Technology DRAM SDRAM-DDR3L, Part #: MT53D1024M32D4DT-053 AAT:D TR | Dynamic random access memory | DEX

Micron Technology DRAM SDRAM-DDR3L, Part #: MT53D1024M32D4DT-053 AAT:D TR | Dynamic random access memory | DEX

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Micron Technology DRAM SDRAMMobile-, Part #: MT53D1024M32D4DT-053 AAT:D TR features:

  • VDD = VDDQ = 1.5V ±0.075V
  • 1.5V center-terminated push/pull I/O
  • Differential bidirectional data strobe
  • 8n-bit prefetch architecture
  • Differential clock inputs (CK, CK#)
  • 8 internal banks
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Programmable CAS READ latency (CL)
  • Posted CAS additive latency (AL)
  • Programmable CAS WRITE latency (CWL) based on t CK
  • Fixed burst length (BL) of 8 and burst chop (BC) of 4 (via the mode register set [MRS])
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Self refresh mode
  • TC of 0°C to 95°C – 64ms, 8192 cycle refresh at 0°C to 85°C – 32ms, 8192 cycle refresh at 85°C to 95°C
  • Self refresh temperature (SRT)
  • Automatic self refresh (ASR)
  • Write leveling
  • Multipurpose register
  • Output driver calibration

 

MIL:MT53D1024M32D4DT-053 AAT D TR

MT53D1024M32D4DT-053 AAT:D TR

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