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MICRON TECHNOLOGY INC

Micron Technology DRAM , Part #MT47H128M16RT-25E AIT:C TR | Dynamic random access memory | DEX

Micron Technology DRAM , Part #MT47H128M16RT-25E AIT:C TR | Dynamic random access memory | DEX

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Micron Technology DRAM SDRAM-DDR2, Part #MT47H128M16RT-25E AIT:C TR

 

Features

  • Industrial and automotive temperature compliant
  • VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V • JEDEC-standard 1.8V I/O (SSTL_18-compatible) Differential data strobe (DQS, DQS#) option
  • 4n-bit prefetch architecture • Duplicate output strobe (RDQS) option for x8
  • DLL to align DQ and DQS transitions with CK
  • 8 internal banks for concurrent operation • Programmable CAS latency (CL) • Posted CAS additive latency (AL)
  • WRITE latency = READ latency - 1 tCK
  • Programmable burst lengths (BL): 4 or 8
  • Adjustable data-output drive strength
  • 32ms, 8192-cycle refresh
  • On-die termination (ODT)
  • RoHS-compliant
  • Supports JEDEC clock jitter specification
  • AEC-Q100
  • PPAP submisson
  • 8D response time


MIL:MT47H128M16RT-25E AIT:C TR

MT47H128M16RT-25E AIT:C TR

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