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MICRON TECHNOLOGY INC

Micron Technology DRAM SDRAMMobile-, Part #: MT49H16M36SJ-18:B | Dynamic random access memory | DEX

Micron Technology DRAM SDRAMMobile-, Part #: MT49H16M36SJ-18:B | Dynamic random access memory | DEX

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Micron Technology DRAM RLDRAM2, Part #: MT49H16M36SJ-18:B features: • 533 MHz DDR operation (1.067 Gb/s/pin data rate) • 38.4 Gb/s peak bandwidth (x36 at 533 MHz clock frequency) • Organization – 64 Meg x 9, 32 Meg x 18, and 16 Meg x 36 I/O – 8 banks • Reduced cycle time (15ns at 533 MHz) • Nonmultiplexed addresses (address multiplexing option available) • SRAM-type interface • Programmable READ latency (RL), row cycle time, and burst sequence length • Balanced READ and WRITE latencies in order to optimize data bus utilization • Data mask for WRITE commands • Differential input clocks (CK, CK#) • Differential input data clocks (DKx, DKx#) • On-die DLL generates CK edge-aligned data and output data clock signals • Data valid signal (QVLD) • 32ms refresh (16K refresh for each bank; 128K refresh command must be issued in total each 32ms) • HSTL I/O (1.5V or 1.8V nominal) • –Ω matched impedance outputs • 2.5V VEXT, 1.8V VDD, 1.5V or 1.8V VDDQ I/O • On-die termination (ODT) RTT

 

MIL:MT49H16M36SJ-18 B

MT49H16M36SJ-18:B

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