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Xilinx Field Programmable Gate Array | FPGA | part # XA7A50T-1CPG236Q | DEX

Xilinx Field Programmable Gate Array | FPGA | part # XA7A50T-1CPG236Q | DEX

Regular price $97.72 USD
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Xilinx Field Programmable Gate Array - FPGA - part # XA7A50T-1CPG236Q is optimized for the lowest cost and power with small form-factor packaging for high-volume automotive applications. Designers can leverage more logic per watt compared to the Spartan®-6 family. Built on a state-of-the-art high-performance/low-power (HPL) 28 nm high-k metal gate (HKMG) process technology, XA Artix-7 FPGAs redefine low-cost alternatives with more logic per watt. Unparalleled increase in system performance with 52 Gb/s I/O bandwidth, 100,000 logic cell capacity, 264 GMAC/s DSP, and flexible built-in DDR3 memory interfaces enable a new class of high-throughput, low-cost automotive applications. XA Artix-7 FPGAs also offer many high-end features, such as integrated advanced Analog Mixed Signal (AMS) technology. Analog becomes the next level of integration through the seamless implementation of independent dual 12-bit, 1 MSPS, 17-channel analog-to-digital converters. Most importantly, XA Artix-7 FPGAs proudly meet the high standards of the automotive grade with a maximum temperature of 125°C.



• Automotive Temperatures:

• I-Grade: Tj= –40°C to +100°C

• Q-Grade: Tj= –40°C to +125°C

• Automotive Standards:

• ISO-TS16949 compliant

• AEC-Q100 qualification

• Production Part Approval Process (PPAP) documentation

• Beyond AEC-Q100 qualification is available upon request

• Advanced high-performance FPGA logic based on real 6-input look-up table (LUT) technology configurable as distributed memory

• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering

• Sub-watt performance in 100,000 logic cells

• High-performance SelectIO™ technology with support for DDR3 interfaces up to 800 Mb/s

• High-speed serial connectivity with built-in serial transceivers from 500 Mb/s to maximum rates of 6.25 Gb/s, enabling 50 Gb/s peak bandwidth (full duplex)

• A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

• Single-ended and differential I/O standards with speeds of up to 1.25 Gb/s

• 240 DSP48E1 slices with up to 264 GMACs of signal processing

• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter

• Integrated block for PCI Express® (PCIe®), for up to x4 Gen2 Endpoint

• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction

• Low-cost wire-bond packaging, offering easy migration between family members in the same package, all packages available Pb-free

• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology

• Strong automotive-specific third-party ecosystem with IP, development boards, and design services




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